Skip to content

FR-Ultra

Wafer thickness measurement system

Introduction

FR-Ultra is a unit dedicated for the fast, accurate and non-destructive measurement of thick and ultra-thick semiconductor and transparent layers.

Thanks to its advanced optics, FR-Ultra can measure either smooth or rough films & substrates of very high thickness.

 

Typical applications include:

  • Thickness measurement of thick glasses (up to 2mm in thickness either clear or haze)
  • Thickness measurement of wafers (e.g. Single or Double
  • Side Polished wafers up to 12in in diameter).
  • FR-Ultra can be easily integrated with Cartesian and Polar stages for thickness mapping over large areas.

Applications

  • Univ. & Research labs
  • Semiconductors(Oxides, Nitrides, Si, Resists, etc.)
  • Polymer & Resist characterization
  • Dielectric characterization
  • Hardcoat, Anodization
  • And more…

(Contact us with your requirements)

Features

  • Single-click analysis (no need for initial guess)
  • Dynamic measurements
  • 800+ materials
  • Multiple installations for off-line analysis
  • Free of-charge Software update

SPECIFICATIONS (STANDARD CONFIGURATIONS)*

ModelNIR/N3VIS/NIR
WL Range -nm
1280-1350380-1000
Pixels5122048
Thick. Accuracy*,**0.4%0.2%
API support
Light SourceSLED (internal), > 150000h (MTBF)Tungsten, 2000h (MTBF)
Integration Time5msec (min)5msec (min)
Objective Lens5X10X20X5X10X20X
Thickness range (n=1.5)10μm – 2mm10μm – 2mm10μm – 1.9mm10μm – 2mm10μm – 2mm10μm – 1.9mm
Si Thickness range (n=3.5)7μm – 1mm7μm – 1mm7μm – 0.9mm7μm – 1mm7μm – 1mm7μm – 0.9mm
Spot size40μm18μm12μm40μm18μm12μm
Nominal WD45mm34mm31mm45mm34mm31mm
WD tolerance @100 μm
thickness
16mm4mm1.2mm16mm4mm1.2mm
WD tolerance @500μm
thickness
4mm1.2mm0.8mm4mm1.2mm0.8mm
Material Database> 800 different materials
Dimensions/Weight39x32x22cm (LxWxH), 13Kg (stage excluded)
Power110V/230V, 50-60Hz, 50W110V/230V, 50-60Hz, 30W
SW CharacteristicsSW Characteristics FR-Monitor v4.0 (free of charge Updates)

ACCESSORIES

Camera: Optical module for visualization of the area under characterization and measurement spot
Stage: XY-A200 (200mm travel) or RΘ-150 (300mm diameter) stage for wafer mapping