FR-Scanner-AIO-Mic-XY200
Automated & Fastmapping of films in the micron lateral scale
Introduction
FR-Scanner-AIO-Mic-XY200 is a holistic platform for the fully-automated in-depth characterization of patterned single and multilayer coatings on wafers. It provides 200mm of travel along X and Y axes and is suitable for accurate while the measurements sample is secured on the stage through vacuum. The tool is offered in an endless range of optical configurations within the 200-1700nm spectral range.
FR-Scanner-AllInOne-Mic-XY200 integrates under the same roof state-of-the-art optical, electronic, and mechanical modules for the accurate & precise characterization of patterned films. Typical examples include (but are not limited to): micro-patterned surfaces, rough surfaces, and numerous others. The wafer is placed on a vacuum chuck that supports any wafer size up to 200mm diameter and is equipped with reflectance standards. The characterization is performed by a powerful optical module with a spot size as small as a few microns. The motorized XY stage provides travel of 200mm on each axis with unprecedented speed, accuracy & repeatability.
FR-Scanner-AIO-Mic-XY200 provides:
- Real-time spectroscopic reflectance measurements
- Film thickness, optical properties, non-uniformity measurements, thickness mapping
- Imaging with integrated high-quality color camera
- Wide range of statistics for the parameters under characterization
- Semi-automatic pattern alignment capability formapping of periodic small patterns
- Unique S/W features such as: Click2Move, Scale bar
Applications
- Univ. & Research labs
- Semiconductors(Oxides, Nitrides, Si, Resists, etc.)
- MEMS devices(Photoresists, Si, Resists, etc.)
- LEDs, VCSELs
- Data Storage
- Polymer coatings(adhesives, etc.)
- And more…
(Contact us with your requirements)
Features
- Single-click analysis (no need for initial guess)
- Dynamic measurements
- Optical parameters (n & k, color)
- Click2Move & Pattern alignment functions
- Multiple installations for offline analysis
- Free of-charge Software update
SPECIFICATIONS (STANDARD CONFIGURATIONS)*
Model | UV/VIS | UV/NIR-EXT | UV/NIR-HR | D UV/NIR | VIS/NIR | D VIS/NIR | NIR | NIR-N2 | |
---|---|---|---|---|---|---|---|---|---|
Spectral Range (nm) | 200 – 850 | 200 – 1000 | 190 – 1100 | 200 – 1700 | 380 – 1020 | 370 – 1700 | 900 – 1700 | 900 – 1050 | |
Spectrometer | Simultaneous measurement of 4 layers with adequate refractive index contrast | ||||||||
Spectrometer Pixels | 3648 | 3648 | 2048 | 3648 & 512 | 3648 | 3648 & 512 | 512 | 3648 | |
Thicknes s range (SiO2) | 5X- VIS/NIR | 4nm – 60μm | 4nm – 70μm | 4nm – 80μm | 4nm – 150μm | 15nm – 90μm | 15nm–150μm | 100nm-150μm | 4μm – 1mm |
10X-VIS/NIR 10X-UV/NIR* | 4nm – 50μm | 4nm – 60μm | 4nm – 65μm | m 4nm – 130μm | 15nm – 80μm | 15nm–130μm | 100nm–130μm | – | |
15X- UV/NIR * | 4nm – 40μm | 4nm – 50μm | 4nm – 50μm | 4nm – 120μm | 15nm – 60μm | – | 100nm-100μm | – | |
20X- VIS/NIR 20X- UV/NIR * | 4nm – 25μm | 4nm – 30μm | 4nm – 30μm | 4nm – 50μm | 15nm – 50μm | 15nm – 60μm | 100nm – 60μm | – | |
40X- UV/NIR * | 4nm – 4μm | 4nm – 4μm | 4nm – 5μm | 4nm – 6μm | – | – | – | – | |
50X- VIS/NIR | – | – | – | – | 15nm – 7μm | 15nm – 8μm | 100nm – 8μm | – | |
Min. Thickness for n & k | 50nm | 100nm | 100nm | 500nm | – | ||||
Number of layers | Simultaneous measurement of 4 layers with adequate refractive index contrast | ||||||||
Thickness Accuracy ** | 0.2% or 1nm | 0.2% or 2nm | 3nm or 0.3% | ||||||
Thickness Precision ** | 0.02nm | 0.02nm | <1nm | 5nm | |||||
Thickness stability ** | 0.05nm | 0.05nm | <1nm | 5nm | |||||
Light Source | Deuterium & Halogen (internal), 2000h (MTBF) | Halogen (internal) | |||||||
Microscope module | Microscope column with 2MP/5MP color image sensor with wide observation area | ||||||||
Stage resolution | Better than 0.5μm | ||||||||
Stage repeatability | ±2μm (bi-directional) | ||||||||
Absolute accuracy | ±3μm | ||||||||
Wafer size | 2in-3in-4in-6in(150mm)-8in(200mm) and of any shape up to 200mm | ||||||||
Scanning Speed | 49meas/90sec (8’’ wafer size) |
OPTIONS
FR-AutoFocus : 100mm long linear axis for autofocus with two modes of operation: Image focus (contrast) / Reflectance intensity
FR-FilterWheel : Motorized filter wheel module fully computer controlled with slots for 8 filters: filter dimensions: diameter of 1inch (clear aperture 23mm).
FR-AutoTurret : Motorized and computer-controlled turret that can accommodate 4 objective lenses: typical switching speed between lenses of 2.0-3.0sec.
Lenses : Long Working Distance VIS/NIR lenses: 5X, 10X, 20X, 40X, 50X, Reflective UV/NIR lenses: 10X, 15X, 20Χ, 25X, 40X
Pump : Low-noise vacuum pump with 2.5L/min and degree of vacuum -60kPa.
Chucks : a) Single diameter wafer chucks (4in, 6in, 200mm) b) Photomask chuck (6in) with reference area c) Multiwafer chuck (100mm, 150mm, 200mm and irregular shape pieces) with reference and dark areas for automated baseline
Enclosure : Enclosure to house the tool, with interlock to activate the shutter or shut-down thelamp when the door to load the wafer opens