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FR-Scanner-AIO-Mic-XY200

Automated & Fastmapping of films in the micron lateral scale

Introduction

FR-Scanner-AIO-Mic-XY200 is a holistic platform for the fully-automated in-depth characterization of patterned single and multilayer coatings on wafers. It provides 200mm of travel along X and Y axes and is suitable for accurate while the measurements sample is secured on the stage through vacuum. The tool is offered in an endless range of optical configurations within the 200-1700nm spectral range.

FR-Scanner-AllInOne-Mic-XY200 integrates under the same roof state-of-the-art optical, electronic, and mechanical modules for the accurate & precise characterization of patterned films. Typical examples include (but are not limited to): micro-patterned surfaces, rough surfaces, and numerous others. The wafer is placed on a vacuum chuck that supports any wafer size up to 200mm diameter and is equipped with reflectance standards. The characterization is performed by a powerful optical module with a spot size as small as a few microns. The motorized XY stage provides travel of 200mm on each axis with unprecedented speed, accuracy & repeatability.

FR-Scanner-AIO-Mic-XY200 provides:

  • Real-time spectroscopic reflectance measurements
  • Film thickness, optical properties, non-uniformity measurements, thickness mapping
  • Imaging with integrated high-quality color camera
  • Wide range of statistics for the parameters under characterization
  • Semi-automatic pattern alignment capability formapping of periodic small patterns
  • Unique S/W features such as: Click2Move, Scale bar

Applications

  • Univ. & Research labs
  • Semiconductors(Oxides, Nitrides, Si, Resists, etc.)
  • MEMS devices(Photoresists, Si, Resists, etc.)
  • LEDs, VCSELs
  • Data Storage
  • Polymer coatings(adhesives, etc.)
  • And more…

(Contact us with your requirements)

Features

  • Single-click analysis (no need for initial guess)
  • Dynamic measurements
  • Optical parameters (n & k, color)
  • Click2Move & Pattern alignment functions
  • Multiple installations for offline analysis
  • Free of-charge Software update

SPECIFICATIONS (STANDARD CONFIGURATIONS)*

ModelUV/VISUV/NIR-EXTUV/NIR-HRD UV/NIRVIS/NIRD VIS/NIRNIRNIR-N2
Spectral Range (nm) 200 – 850200 – 1000190 – 1100200 – 1700380 – 1020370 – 1700900 – 1700900 – 1050
SpectrometerSimultaneous measurement of 4 layers with adequate refractive index contrast
Spectrometer Pixels3648364820483648 & 51236483648 & 5125123648
Thicknes
s range
(SiO2)
5X- VIS/NIR4nm – 60μm4nm – 70μm4nm – 80μm4nm – 150μm15nm – 90μm15nm–150μm100nm-150μm4μm – 1mm
10X-VIS/NIR
10X-UV/NIR*
4nm – 50μm4nm – 60μm4nm – 65μmm 4nm – 130μm15nm – 80μm15nm–130μm100nm–130μm
15X- UV/NIR *4nm – 40μm4nm – 50μm4nm – 50μm4nm – 120μm15nm – 60μm100nm-100μm
20X- VIS/NIR
20X- UV/NIR *
4nm – 25μm4nm – 30μm4nm – 30μm4nm – 50μm15nm – 50μm15nm – 60μm100nm – 60μm
40X- UV/NIR *4nm – 4μm4nm – 4μm4nm – 5μm4nm – 6μm
50X- VIS/NIR15nm – 7μm15nm – 8μm100nm – 8μm
Min. Thickness for n & k50nm100nm100nm500nm
Number of layersSimultaneous measurement of 4 layers with adequate refractive index contrast
Thickness Accuracy **0.2% or 1nm0.2% or 2nm3nm or 0.3%
Thickness Precision **0.02nm0.02nm<1nm5nm
Thickness stability **0.05nm0.05nm<1nm5nm
Light SourceDeuterium & Halogen (internal), 2000h (MTBF)Halogen (internal)
Microscope moduleMicroscope column with 2MP/5MP color image sensor with wide observation area
Stage resolutionBetter than 0.5μm
Stage repeatability±2μm (bi-directional)
Absolute accuracy±3μm
Wafer size2in-3in-4in-6in(150mm)-8in(200mm) and of any shape up to 200mm
Scanning Speed49meas/90sec (8’’ wafer size)

OPTIONS

FR-AutoFocus : 100mm long linear axis for autofocus with two modes of operation: Image focus (contrast) / Reflectance intensity
FR-FilterWheel : Motorized filter wheel module fully computer controlled with slots for 8 filters: filter dimensions: diameter of 1inch (clear aperture 23mm).
FR-AutoTurret : Motorized and computer-controlled turret that can accommodate 4 objective lenses: typical switching speed between lenses of 2.0-3.0sec.
Lenses : Long Working Distance VIS/NIR lenses: 5X, 10X, 20X, 40X, 50X, Reflective UV/NIR lenses: 10X, 15X, 20Χ, 25X, 40X
Pump : Low-noise vacuum pump with 2.5L/min and degree of vacuum -60kPa.
Chucks : a) Single diameter wafer chucks (4in, 6in, 200mm) b) Photomask chuck (6in) with reference area c) Multiwafer chuck (100mm, 150mm, 200mm and irregular shape pieces) with reference and dark areas for automated baseline
Enclosure : Enclosure to house the tool, with interlock to activate the shutter or shut-down thelamp when the door to load the wafer opens