FR-CasScan is a radical & holistic wafer characterization system at production environments. FR-CasScan provides fully automated characterization of films on wafers along with a robust Cassette Loader. FR-CasScan is equipped with advanced features such such as: pre-aligner, high resolution and repeatability XY stage with 200mm travel on each axis, powerful UV/VIS/NIR autofocus microscope, high resolution spectrometer and numerous accessories (OCR, SECS/GEM, …)
With FR-CasScan, the accurate, fast and detailed characterization of ultra-thin, thin, thick & very-thick films on wafers is just a click away. The very low Total Cost of Ownership system is designed to handle heavy loads (even bonded wafers) without maintenance.
The cassette loading unit automatically pre-align and load wafers on the microscope’s stage. The unit offers high speed, safe and smooth wafer handling (wafer thickness down to 200μm) and automatic wafer size detection.
The measurement unit is equipped with fast and with high accuracy & repeatability motorized XY-stage capable to map wafers of any diameter up to 8in.
Automatic mapping mode, e.g. patterned wafers – in combination with automated wafer loading from cassette or manual loading – by means of point-to-point measurements through joystick or software is supported.
The system, comes with a powerful optical autofocus microscope with travel up to 80mm and several long working distance objective lenses that guarantee measurement with spot size < 4μm.
- Semiconductors fabrication
- University & Research labs
- Resist characterization
- Hardcoats, Anodization
- Optical Coatings
- And more…
(Contact us with your requirements)
- Auto wafer loading on the cassette recognition
- Auto notch detection and wafer pre-alignment
| Model | UV/VIS | UV/NIR-HR | D UV/NIR | VIS/NIR | D VIS/NIR | NIR | |
|---|---|---|---|---|---|---|---|
| Spectral Range (nm) | 200 – 850 | 200 – 1100 | 200 – 1700 | 380 – 1020 | 370 – 1700 | 900 – 1700 | |
| Sprectrometer Pixels | 3648 | 2048 | 3648 & 512 | 3648 | 3648 & 512 | 512 | |
| Thickness range | 5X – VIS/NIR | 4nm – 60μm | 4nm – 110μm | 4nm – 150μm | 15nm – 90μm | 15nm–150μm | 100nm-150μm |
| 10X – VIS/NIR 10X – UV/NIR* | 4nm – 50μm | 4nm – 80μm | 4nm – 130μm | 15nm – 80μm | 15nm–130μm | 100nm–130μm | |
| 15X – UV/NIR* | 4nm – 40μm | 4nm – 50μm | 4nm – 120μm | – | – | 100nm-100μm | |
| 20X – VIS/NIR 20X – UV/NIR* | 4nm – 25μm | 4nm – 30μm | 4nm – 50μm | 15nm – 50μm | 15nm – 60μm | 100nm – 60μm | |
| 40X – UV/NIR* | – | 15nm – 5μm | – | 15nm – 7μm | 15nm – 8μm | 100nm – 8μm | |
| 50X – VIS/NIR | 50nm | 50nm | 50nm | 100nm | 100nm | 500nm | |
| Min. Thickness for n & k | 0.2% or 1nm | 0.2% or 2nm | 3nm or 0.3% | ||||
| Thickness Accuracy * | 0.02nm | 0.02nm | <1nm | ||||
| Thickness Precision ** | 0.05nm | 0.05nm | <1nm | ||||
| Thickness stability ** | Balanced Deuterium & Halogen, 2000h (MTBF) | Halogen (internal), 3000h (MTBF) | |||||
| Light Source | Balanced Deuterium & Halogen, 2000h (MTBF) | Halogen (internal), 3000h (MTBF) | |||||
| Pre-Aligner module | Included | ||||||
| Wafer types | Si, LiNbO3, GaAs, Ge,Al2O3, Glass, SiC,other semiconductor substrates | ||||||
| Wafer Sizes | 6in & 8in for automated handling & loading. 2in-8in for manual loading (irregular shape) | ||||||
| Wafer Handling | High reliability carbon fiber end effector, Cassette laser mapping | ||||||
| Material Database | > 800 different materials | ||||||
| Dimensions & Weight | Dimensions: 150x79x150cm (LxWxH) main tool, 90x79x75cm (LxWxH) computer table. Total Weight: 260Kgr |
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| Clean Room compatibility | Class 10 | ||||||
| Power requirement | Power Requirements: 230±10% VAC, 50-60 Hz, 1KVA | ||||||
| Dry air requirements | 600 kPa, >100 Nl/min (normal liter per min) | ||||||
| Vacuum requirements | -75 to -90 kPa, >10 Nl/min (normal liter per min) | ||||||
| PC characteristics | AllInOne Win10/11, i7-12gen CPU, 16GB RAM, SSD disk, 23.8in monitor | ||||||
